CELSIUS - 三维热设计和分析工具
CELSIUSTM为您的桌面提供了功能强、易于使用的3D热设计和分析工具。它提供快速、准确的结果、边界的准确建模和开放区域问题的简单分析。
在包括零件成型、粘合和硬化在内的很多应用中,被加热零件内随时间的热量分布是不可缺少的。如果没有这些知识,该过程将以特别的方式执行。结果,这种知识的缺乏将在质量、上市时间或过多的材料和能源成本方面增加产品成本。
除了模拟零件外,设计加热零件的环境也很紧要。对于感应加热,线圈的形状可以在加热过程中发挥作用。此外,加热设备可以以不同的频率驱动,这也会影响加热过程的质量和效率。为了迎合这些问题,需要有限元或有限元方法的组合。真正的问题是了解过程并找到产生有用结果所需的模拟水平。
特征:
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适用于各种应用的3D静态和瞬态热分析场求解器
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我们的软件包包括:
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求解器的选择:为确保您对解决方案有信心并进行独立验证,BEM和FEM方法都包含在同一个软件包中,以满足您的特定应用需求。并非每个求解器都适合每个应用程序,没有“一刀切“
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优化工具的选择:参数分析适用于那些需要快速方便优化且学习曲线短的人。API和脚本为高等用户提供了更多功能。这两种工具都在同一个包中。
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内置材料库:自定义和创建您自己的库,以便方便访问您使用的材料
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与MATLAB®集成:用户的MATLAB代码可以包含对INTEGRATED API的函数调用,以构建几何、分配物理参数、求解和获得结果
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并行化:在64位计算机上使用时,可以充分利用可用RAM,从而显著提高求解速度和后处理速度
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直观的界面,可根据用户偏好(整体外观、工具栏、求解器、背景、默认值等)方便定制
应用:
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电子包装
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散热片
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吸热器
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家电
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航空航天部件
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汽车零件部
系统要求:
64位操作系统
Microsoft® Windows 10或更高版本
安装需要大约110MB的磁盘空间
3D程序
至少4GB的RAM运行,但对于应该使用16GB或更多RAM的较大问题,不建议这样做。使用的RAM越多,解决大问题的速度就越快
强烈建议使用多核处理器,因为3D程序是多线程的
【英文介绍】
CELSIUSTM delivers a powerful, easy to use, 3D thermal design and analysis tool right to your desktop. It provides fast, accurate results, exact modeling of boundaries and easy analysis of open region problems.
In many applications including part forming, bonding and hardening, the heat distribution over time within the part being heated is essential. Without this knowledge the process is carried out in an ad hoc manner. Ultimately, this lack of knowledge will be an added cost to the product in terms of quality, time to market, or excess material and energy costs.
In addition to simulating the part, designing the environment in which the part is heated may also be important. For induction heating, the shape of the coils can play a major part in the heating process. In addition, the heating equipment can be driven at different frequencies which will also affect the quality and efficiency of the heating process. To cater to these problems, a finite element or a combination of finite element methods is required. The real question is to understand the process and find the level of simulation required to produce useful results.
Features
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3D static and transient thermal analyses field solver for a diverse range of applications.
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At no extra cost, our software packages include:
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Choice of solvers: To ensure you have confidence in the solution and for independent verification, both BEM and FEM methods are included in the same software package to suit your specific application needs. Not every solver fits every application, no“one size fits all”.
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Choice of optimization tools: Parametric Analysis for those who need fast and easy optimization with a short learning curve. API and Scripting give more power to advanced users. Both tools are available in the same package.
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Built-in material libraries: Customize and create your own library for easy access to the materials you use.
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Integration with MATLAB®: Users' MATLAB code can include function calls to the INTEGRATED API to build geometry, assign physical parameters, solve, and obtain results.
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Parallelization: When used on 64-bit computers, this permits full utilization of the available RAM to dramatically increase speed of solution and post-processing.
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Intuitive interface that can be easily customized according to user preferences (overall appearance, toolbars, solvers, backgrounds, defaults, etc.).
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